• UPH:
  • Accuracy:
  • Substrate size:
  • 180K
  • 5~10μm
  • 600,400,300mm

MicroLED Mass Transfer Equipment

The equipment is applied to mini/micro LED flip chip die bonding process on substrate.Different from the traditional die bonding or flip chip die bonding technology, our solution to mass transfer based on high acceleration and high accuracy needle punching process resolves the micro/mini chips mass transfer issue, while ensuring the transfer efficiency and quality, also solving the low yield and hidden reliability faced by the global industry.  


3.Substrate size:600×600mm,400×400mm,300×300mm