Chinese
project
  • Bonding cycle:
  • Accuracy:
  • BPO:
  • 40ms
  • ±2μm@3σ
  • ≥40μm BPP

Ball Bonder ROCKET 100

Ball Bonder ROCKET IC is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.

Material

Material：SOP、SOT、QFP、DFN、DIP、QFN、BGA、etc.

Performance

1.Bonding cycle:40ms
2.Accuracy:±2μm@3σ
3.BPO≥40μm.
4.SAA for bond head temperature control.
5.Bonding accuracy adjustment (±2 μm).
6.60% compressed air saving with moving magnet motor XY platform design. Air cooling is not required.
7.Enhanced PR ability against die tilt and rotation, optional dual path optics design.
8.Enhanced EFO/NSD module with AC/DC multi-mode switching.
9.Enhanced looping algorithm and looping consistency.