project
  • Bonding Speed:
  • Bonding Accuracy:
  • Maximum lead frame width:
  • 40ms/wire
  • ±2μm
  • 100mm

Wire Bonder ROCKET 100

Wire Bonder ROCKET 100 is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.

Material

Used for IC packaging, SOP、SOT、QFP、 DFN、 DIP、QFN、 BGA etc.

Performance

1. To handle leadframe with maximum 100mm width.
2. Dual frequency uitrasonic transducer (can svitch to highylow frequency during operation).
3. Stability: MTBA>2hrs.
4. Fine bond force control for thin or fragile material.
5. Dual path optics(optional).
6.Handle BPO>40μm product.