- Bonding cycle:
- Accuracy:
- BPO:
- Maximum lead frame width:
- 40ms/wire
- ±3μm
- ≥35μm
- 83mm
Wire Bonder ROCKET LED
Wire Bonder ROCKET LED is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Material
Suitable for all kinds of materials：2835，5050，2121RGB，1515RGB，1010RGB，020，Filament，etc.
Performance
1.Fast，UPH 40k (2 wire 2835 with Q loop), UPH 16K (5 wire RGB 1515 with Q loop).