- Bonding speed:
- Bonding accuracy:
- Downset depth:
- 40ms/wire
- ±2μm
- 12mm
Wire Bonder ROCKET PHOTON
Wire Bonder ROCKET PHOTON is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Suitable material
Suitable for optical communication devices (COC, COS, TO-CAN , TOSA, ROSA, etc.) , sensors , MEMS , lasers , microwave components , discrete devices , RF modules, power devices , etc
Performance feature
1.Handle deep downset product, using 16mm, 19mm capillary.
2.SAA for bond head temperature control.
3.Bonding accuracy adjustment (±2 μm).
4.60% compressed air saving with moving magnet motor XY platform design. Air cooling is not required.
5.Auto focus optics, with 700um focus range.
6.Enhanced EFO/NSD module with AC/DC multi-mode switching.
7.Enhanced looping algorithm and looping consistency.