ABOUT US

        ADA Intelligent Equipment Ltd., founded in 2017 by experts deeply engaged in semiconductor intelligent equipment industry for decades with rich R&D and industrialization experience, is an outstanding semiconductor packaging equipment enterprise with independent intellectual property rights and core technology.
        ADA has applied for 60 patents and independently developed products including wire bonder, die bonder, flip chip bonder, wafer-level flip chip bonder, panel-level die attach equipment and microLED mass transfer equipment. ADA has achieved mass production of wire bonders and die bonders, both of which are certificated as Guangdong Province’s high-tech products that fill the gap of domestic medium to high-end core packaging equipment market and effectively replace imported products.
        Aiming at domestic import substitution and breaking up foreign monopolies, ADA is developing into a leader in domestic advanced packaging industry. ADA is a national high-tech enterprise and Guangdong engineering technology research center of wafer level flip chip & high-density packaging. The company was honored with the Potential Unicorn in 2022 and Seed Unicorn in 2019 and 2020 in Foshan national high-tech Zone. It is also the "Ten Hundred Thousand" Enterprise of the Industrial Developing Project, and Specialized and Special New Enterprise in Foshan. Besides, ADA is an industry university research cooperation base of GDUT and the state key laboratory of "precision electronic manufacturing equipment and technology".

Innovative technology

MicroLED mass transfer technology

Micro LED mass transfer refers to the transfer of tens of thousands of LED chips to the driving backplane and the realization of light-emitting function. Thin epitaxial layers are produced on the wafer through MOCVD.

Ball bonding technology

Ball Bonder is a high-speed automatic wire bonder. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.

Panel-level/wafer-level packaging technology

Panel-level/wafer-level packaging is a scheme for converting from wafer and strip level to larger panel level, where large panel sizes and higher vehicle usage enable mass production of large packages.

CERTIFICATIONS

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