To be a Global Leader in
Semiconductor Automation
Equipment Industry and Core Technology

 ADA Intelligent Equipment Ltd., founded by experts deeply engaged in semiconductor intelligent equipment industry for decades with rich R&D and industrialization experience, is an outstanding semiconductor packaging equipment enterprise with 60+ independent intellectual property rights and core technology in wire bonder, die bonder, flip chip bonder, wafer-level flip chip bonder, panel-level die attach equipment and microLED mass transfer equipment.