Products

More>>

Ball Bonder

High speed automatic Ball bonder, Through the thermal ultrasonic ball welding and wedge welding process…

Read More

Flip-chip/Die Bonder

A wafer level flip-chip welding bonder for IC semiconductor package without wire bond and wire…

Read More

Wafer/Panel Level Packaging Equipment

Wafer level packaging is a kind of conversion scheme from wafer and strip level to larger panel level…

Read More

Media News

More

Honors

"Industry-University-Research Base"of Guangdong University of Technology

"Most Potential Enterprise"of China Lighting Society

Board-level fan-out packaging equipment research and development joint laboratory

Cooperation partners


广东工业大学
国星光电
长电科技
华天科技
固高科技
研究院
鸿利智汇
木林森
晶科电子