Chinese
project
  • Bonding UPH:
  • X-Y bonding accuracy:
  • Rotation accuracy:
  • 10K
  • ±10μm
  • ±3°

Wafer-level flip chip bonder AFC600

Panel-level/wafer-level packaging is a scheme for converting from wafer and strip level to larger panel level, where large panel sizes and higher vehicle usage enable mass production of large packages.

Material

Material：SOP、SOT、QFP、DFN、DIP、QFN、BGA、etc.

Performance

Chip to Panel/Lead Frame